b g f 10 4c h s m mc i n t e rf a c e fi l t e r a n d esd p ro t e c t i o n d at a s he et , v 2. 0 , n ov e m be r 2 00 9 r f & p ro t e c ti o n d e v i c e s www.datasheet.co.kr datasheet pdf - http://www..net/
edition 2009-11-12 published by infineon technologies ag 81726 mnchen, germany ? infineon technologies ag 2009. all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (?beschaffenheitsgarantie?). with r espect to any examples or hints given herein, any t ypical values stated herein and/or any information regarding the application of the device, infineon technologies he reby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery ter ms and conditions and prices please contact your ne arest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contai n dangerous substances. for information on the type s in question please contact your nearest infineon techn ologies office. infineon technologies components may only be used i n life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or syst em. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and s ustain and/or protect human life. if they fail, it is reas onable to assume that the health of the user or oth er persons may be endangered. www.datasheet.co.kr datasheet pdf - http://www..net/
BGF104C hsmmc interface filter and esd protection data sheet 3 v2.0, 2009-11-12 BGF104C revision history: 2009-11-12, v2.0 previous version: 2009-09-14, v1.0 page subjects (major changes since last revision) 4 3d-figure of package updated 5 figure 2 updated 6 footprint ( figure 3 ) added 6 tape specification ( figure 4 ) added all target status removed www.datasheet.co.kr datasheet pdf - http://www..net/
data sheet 4 v2.0, 2009-11-12 BGF104C hsmmc interface filter and esd protection BGF104C BGF104C description BGF104C is an esd protection and filter circuit for a high speed multi media card interface. external pins are protected against esd pulses of 15 kv contact discharge according to iec61000-4-2. t he wafer level package is a green leadfree package with a size of only 1.9 2 mm x 1.92 mm and a total height of 0.65 mm. figure 1 schematic features ? esd protection and filter for high speed multi med ia card interface ? esd protection according to iec61000-4-2 for 15 kv contact discharge on external ios ? 16 pin green wafer level package with snagcu solde r balls ? rohs and weee compliant package ? 500 m solder ball pitch ? 300 m solder ball diameter type package marking chip BGF104C wlp-16-3 4c n0708 wlp-16-3-n bgf104_ schematic.vsd v mmc dat 3 gnd dat 2 dat 1 dat 0 cmd clk mmcdat3 mmcdat2 mmcdat1 mmcdat0 mmccmd mmcclk v dd r2, 50 r10, 75k r14, 7k r3, 50 r4, 50 r5, 50 r6, 50 r7, 50 r11, 75k r12, 75k r13, 75k a4 b4 c4 c3 d4 d3 b3, c2, d2 a3 a2 a1 b2 b1 c1 d1 int. ios ext. ios www.datasheet.co.kr datasheet pdf - http://www..net/
BGF104C hsmmc interface filter and esd protection BGF104C data sheet 5 v2.0, 2009-11-12 package outlines figure 2 wlp-16-3 (dimensions in mm) table 1 maximum ratings parameter symbol values unit note / test condition min. typ. max. voltage at all pins to gnd v p 0 ? 14 v ? operating temperature range t op -40 ? +85 c ? storage temperature range t stg -65 ? +150 c ? electrostatic discharge according to iec61000-4-2 contact discharge external pins to gnd (a1, a2, a3, b1, b2, c1, d1) v esd -15 ? 15 kv ? contact discharge internal pins to gnd (a4, b4,c3, c4, d3, d4) v esd -2 ? 2 kv ? table 2 electrical characteristics 1) 1) at t a = 25 c parameter symbol values unit note / test condition min. typ. max. resistors r 2 ... r 7 r 2...7 40 50 60 ? resistors r 10 ... r 13 r 10...13 52.5 75 97.5 k ? resistor r 14 r 14 4.9 7 9.1 k ? line capacitance, each line to gnd 2) 2) without line coupling by resistors r 7 - r 11 c t ? 16 20 pf v = 0 v reverse current of esd protection diodes i r = 3 v i r = 14 v i r ? 5 0.1 100 10 n a ? pin 1 corner index area 2) 0.65 0.25 0.05 standoff c 0.1 0.05 16xcoplanarity 0.08 c seating plane c 3) a2 a3 a4 a1 b2 b3 b4 b1 c2 c3 c4 c1 d2 d3 d4 d1 0.5 3 x 0.5 = 1.5 0.05 1.92 0.05 (0.21 0.05 (0.21 ) 0.05 (0.21 ) 0.05 (0.21 ) ) b 0.5 0.05 1.92 a 3 x 0.5 = 1.5 16x 1) 0.05 0.3 ?0.05 m a b 1) dimension is measured at the maximum solder ball diameter, parallel to primary datum c 3) primary datum c and seating plane are defined by the spherical crowns of the balls 2) pin 1 corner identified by marking 0.5 wlp-16-3-n-po v01 www.datasheet.co.kr datasheet pdf - http://www..net/
data sheet 6 v2.0, 2009-11-12 BGF104C hsmmc interface filter and esd protection BGF104C footprint figure 3 footprint for wlp-16-3 (dimensions in mm) tape and reel specification figure 4 tape for wlp-16-3 (dimensions in mm) you can find all of our packages, sorts of packing and others in our infineon internet page ?products? : http://www.infineon.com/products wlp-16-3-n-fp v01 0.5 1 0.5 1.5 0.25 wlp-16-3-n-tp v01 4 2.22 8 2.22 0.23 0.77 pin 1 corner index area www.datasheet.co.kr datasheet pdf - http://www..net/
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